Located in a modern 20,000 sq. ft. facility, T.S.I. is equipped to assemble products to the most demanding military and aerospace requirements using most production techniques. Our die mounting methods include eutectic or epoxy and our wire bonding capabilities range from .7 mils to 3 mils for gold (AU) and 1 mil to 20 mils fro aluminum (Al). Both thick and thin film substrates and a wide range of active and passive chips are available to meet your hybrid circuits needs.